Product category:
PCB Assembly Equipment and Tools
News Release from: Contax | Subject: Speedline Technologies Gel-Flex tooling
Edited by the Electronicstalk Editorial
Team on 05 March 2004
Gel-based tooling speeds setup times
Speedline Technologies' new Gel-Flex tooling is a revolutionary new MPM conformal board support system, available in the UK, Ireland and Benelux exclusively from Contax.
Speedline Technologies' new Gel-Flex tooling is a revolutionary new MPM conformal board support system, available in the UK, Ireland and Benelux exclusively from Contax The new Gel-Flex tooling approach is far easier to use and costs less than traditional board support options, including manually set pins, clamps, custom work holders, and fixed-grid pin tooling systems
This article was originally published on Electronicstalk on 14 Apr 2004 at 8.00am (UK)
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In addition, Gel-Flex significantly reduces both initial set-up and board changeover times, particularly for boards with bottom-side components, and will not damage components or leads.
"The beauty of this new gel tooling concept lies in its simplicity.
Since it does not incorporate pins, there is no reason to be concerned about the location of components or leads on the bottom sides of boards.
Gel-Flex uses compressible polyurethane gel support for gentle compliance for components, while providing firm support for the board itself", comments Mike Rapson, Director, PCB Products at Contax.
"The only decision to be made during product setup is to ensure that support blocks are spread consistently across the board, reducing board set-up and product changeover times to seconds, not minutes".
Stencil printing requires level board support for consistent print results and high yields.
Without such support, squeegee pressure across the board will vary and prevent proper gasketing between the stencil and the board, resulting in inconsistent paste deposition, particularly with BGA and fine-pitch devices.
Substantial testing has confirmed that Gel-Flex tooling meets these requirements.
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