Dispenser is precise about lead-free paste

The XyflexPro+ features advanced technology that delivers an increased speed rating that is over 30% higher than other dispensing systems, and claims twice the accuracy.

Contax is offering Speedline's Camalot XyflexPro+ dispenser exclusively in the UK, Ireland and Benelux.

This dispenser won the Vision award for excellence in product innovation at Apex 2006, and its architecture and performance is highly acclaimed worldwide.

The XyflexPro+ features advanced technology that delivers an increased speed rating that is over 30% higher than other dispensing systems, and claims twice the accuracy.

Other features include: throughput increases across all dispense applications, with a faster point-to-point movement and virtual elimination of z-axis travel time; an increase in the gross dot placement rate to 45,000 per hour; a unique line sequence for faster, smoother travel around corners when dispensing underfill, encapsulation and micro display applications; and a pipeline conveyor mode that allows parallel product transfer between conveyor zones, reducing transfer time by up to 40%.

The platform's innovative architecture provides the ultimate in user flexibility, allowing the retrofitting of any option at any time in the field, as well as the ability to change to and from SMT to semiconductor applications with minimal downtime.

The XyflexPro+ features include Speedline's patented dispense technology, a multiple-piston pump, positive shutoff dispense units (DU), standard auger and microdot DUs.

By combining these with Speedline's Benchmark software, the XyflexPro+ offers ease of use together with the ability to control precisely the dispense volumes, offering superb speed and accuracy.

Explained Mike Rapson, Managing Director at Contax : "The XyflexPro+ is proven to be capable of accurately dispensing a wide range of materials, when solder paste dispensing flux formation is key and not at all dependent on alloy type".

He continued: "Experience shows that the difference between lead free and leaded solder pastes occurs in the spread during reflow rather than the dispensing".

"As lead-free alloys do not spread or wet as well as leaded, any paste not accurately dispensed onto the board will remain close to the dispensing point after reflow soldering".

"With its improved gantry performance, XyflexPro+ is more than capable of handling the pinpoint accuracy that lead-free dispensing demands", he concluded.

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