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Product category: Electronics Manufacturing Quality Assurance
News Release from: Contax | Subject: Micromex
Edited by the Electronicstalk Editorial Team on 30 March 2007

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Submicron high-resolution X-ray system for manual and automatic solder joint inspection is enhanced with new inspection software

Phoenix X-Ray's micromex X-ray inspection system now offers new inspection software Available exclusive from Contax in the UK and Ireland, micromex is a submicron high-resolution system for manual and automatic solder joint inspection

This includes automatic X-ray inspection of PCB assemblies such as BGAs, CSPs, MLFs and QFPs.

The micromex uses an integrated 2Mpixel camera, so exceeding the existing standard of 1.3Mpixel.

This, combined with the open 160 or 180kV submicron X-ray tube, enables detailed analysis with a resolution of better than 1um as well as a total magnification up to 13,300x.

The micromex offers highly precise manipulation with a 360 degree rotation axis and the approved technology for oblique views of up to 70 degrees.

The scanning area has a size of 4572 x 3556mm.

This enables samples up to 680 x 635mm and up to 5kg in weight, to be inspected without problems.

The new quality assurance software was designed to offer ease of use, together with many-sided fully digital image processing.

In addition, the powerful algorithm toolbox XE2 offers the best solution for application testing.

"The micromex is an ideal system for solder joint inspection in any production or laboratory environment", said Mike Rapson, Managing Director at Contax.

"In addition to the system's high performance capabilities, it features a board handling facility for the automated loading of assembled boards".

"This enables multiple inspection tasks to be carried out and repeated in an easy, reliable and time-saving manner", he said.

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