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Cookson Electronics
Address:
Forsyth Road
Sheerwater
Woking
GU25 5RZ
UK
Telephone: (UK) +44 1483 758400
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Listing of all 19 news releases from Cookson Electronics:
Pb-free paste survives under the bonnet
Alpha OM-350 with InnoLot alloy has been developed to meet the growing demand for a more robust alloy that provides superior and reliable solder joints.
News from Cookson Electronics (25 February 2008)
Tin market boom puts surcharge on solder
Cookson Electronics Assembly Materials has placed a surcharge on its Alpha brand tin-bearing solder pastes, effective 30 days from customer notification.
News from Cookson Electronics ( 2 April 2007)
New group integrates extensive knowledge base
Cookson Electronics Assembly Materials has set up its Global Applications Technology and Engineering group, which joins its global R and D group.
News from Cookson Electronics (11 August 2006)
IPC certifies 23 Cookson electronics engineers
Cookson Electronics Assembly Materials global team of 23 applications engineers were trained and certified as IPC Specialists in May
News from Cookson Electronics (28 July 2006)
Paste keeps pins clean for testing
Lead-free no-clean solder paste promises unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.
News from Cookson Electronics (15 May 2006)
Custom alloy cuts cost of Pb-free soldering
As the lead-free deadline approaches, Cookson Electronics is reporting spectacular growth in sales of Alpha Vaculoy SACX across Europe.
News from Cookson Electronics (24 April 2006)
Wave solder flux is environmentally friendly
Alpha EF-6100 low-solids wave solder flux is the latest addition to the EF Series of environmentally friendly fluxes
News from Cookson Electronics (11 April 2006)
Shenzhen plant meets standards trifecta
On 7th March 2006, BSI officially presented three Business Management Certificates to Cookson Electronics' executives at their site in Shenzhen, China.
News from Cookson Electronics (11 April 2006)
Device cools packages during lead-free reflow
Cookson Electronics Assembly Materials announces the launch of Alpha Coolcap thermal protection devices, developed to cool components during high temperature lead-free reflow and rework processes.
News from Cookson Electronics (10 November 2005)
Next dimension in substrate and wafer bumping
Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed.
News from Cookson Electronics (10 November 2005)
Lead-free wave solder alloy with high yield
Since its introduction in early 2004 by Cookson Electronics Assembly Materials, Alpha Vaculoy SACX lead-free wave solder alloy has set a new benchmark for performance.
News from Cookson Electronics (10 November 2005)
Latest lead-free soldering materials go on display
Cookson Electronics Assembly Materials will show its complete line of Alpha lead-free soldering materials on stand 262 in Hall 4 at Productronica 2005, including soldering alloys, fluxes and pastes.
News from Cookson Electronics (27 September 2005)
Novel alloy claims top lead-free performance
A new wave-soldering alloy is claimed to outperform the standard lead free solder bars currently available and so ease the trauma of transition to lead-free assembly.
News from Cookson Electronics (19 September 2005)
Wipes set to clean up stencil operations
Bioact SC-10 wipes are tough, long lasting lint free cloths, saturated in a mixture of organic solvents designed specially for nonaqueous cleaning operations.
News from Cookson Electronics (19 September 2005)
Solder preforms work with pick and place lines
Tape and reel packaged solder preforms allow measured amounts of solder to be deposited accurately, selectively and without special equipment.
News from Cookson Electronics (19 September 2005)
Brown turns to flux chemistry
After 3 successful years as Regional Marketing Manager with Cookson Electronics Assembly Materials, Steve Brown is moving into the role of Global Product Manager - Flux Chemistry.
News from Cookson Electronics (16 September 2005)
Solder waste requires special procedures
Cookson Electronics is the UK's largest solder reclaim operation and is highly experienced in the reprocessing of solder dross, paste etc, including meeting all legal and environmental obligations.
News from Cookson Electronics (16 September 2005)
Lead-free range aims for wider process window
Cookson Electronics has focused on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar.
News from Cookson Electronics (15 September 2005)
Stencils claim exceptional paste volume control
Alphaform electroformed stencils are designed for ultra-fine-pitch tolerances in surface mount and microelectronics applications, and for high volume assemblers.
News from Cookson Electronics (15 September 2005)

