Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Cookson Electronics | Subject: Alpha lead-free soldering materials
Edited by the Electronicstalk Editorial
Team on 27 September 2005
Latest lead-free soldering materials go
on display
Cookson Electronics Assembly Materials will show its complete line of Alpha lead-free soldering materials on stand 262 in Hall 4 at Productronica 2005, including soldering alloys, fluxes and pastes.
Cookson Electronics Assembly Materials will show its complete line of Alpha lead-free soldering materials on stand 262 in Hall 4 at Productronica 2005, including soldering alloys, fluxes and pastes Of special interest will be the increasingly favoured Alpha Vaculoy SACX 0307 lead-free alloy that is reported to outperform Sn/Cu/Ni alloys and offer soldering performance equivalent to SAC305, but at some 30% lower material cost
This article was originally published on Electronicstalk on 15 Sep 2005 at 8.00am (UK)
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Lead-free range aims for wider process window
Cookson Electronics has focused on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar.
Stencils claim exceptional paste volume control
Alphaform electroformed stencils are designed for ultra-fine-pitch tolerances in surface mount and microelectronics applications, and for high volume assemblers.
Also featured will be Alpha OM338, a new, lead-free solder paste that will help users simplify the transition to lead-free process thanks to its wide reflow process window and its ultra-fine printing capabilities.
The company will show the recently introduced Alpha EF flux series, designed to cope with the increased temperatures of lead-free soldering and facilitate high reliability assembly.
Exhibited for the first time will be XB3, a new substrate and wafer bumping technology that is said to offer speeds 100 times faster than traditional plating, resulting in higher throughput, and the flexibility to deposit complex alloys, including lead-free.
It can also handle a wide dynamic range of size and pitch.
The company will also launch ALPHA CoolCap, a unique, new technology developed to cool components and semiconductor packages during high temperature lead-free rework and reflow processes.
Technical staff will be on-hand to demonstrate the products and discuss the comprehensive range of lead-free support services available from Cookson.
These include Lead-free assembly training, a process capability validation programme and analytical services to ensure alloy integrity. Request a free brochure from Cookson Electronics ...
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