Device cools packages during lead-free reflow

Cookson Electronics Assembly Materials announces the launch of Alpha Coolcap thermal protection devices, developed to cool components during high temperature lead-free reflow and rework processes.

Cookson Electronics Assembly Materials announces the launch of Alpha Coolcap thermal protection devices, its unique new device developed to cool components and semiconductor packages during high temperature lead-free reflow and rework processes.

Alpha Coolcap provides cost-effective protection without a substantial investment in process changes and redesign, while maintaining the high yield and throughput required by electronic assemblers.

The reusable custom-fitted caps keep semiconductor packages below 245 or 260C and minimise temperature variation within packages from over 10C down to 2-5C, while minimising warpage, popcorning and delamination.

"For the first time in our industry, board assemblers can address costly component yield losses and reliability concerns as they transition to the higher temperatures in lead-free", said Tom Hunsinger, Cookson Electronics' Global Product Manager.

"We are pleased to announce the launch of Alpha Coolcap and accompanying engineering services to our customers".

Alpha Coolcap thermal protection devices can be used in no-clean, water-soluble or RMA processes as a temporary heatsink that can be placed on components either by hand or with existing pick and place equipment.

No adhesive is required and no residue is left on boards or components.

Coolcap can be designed to cool the package body, allowing reflow underneath, or can be designed to 'overcool' - preventing reflow in cases such as adjacent packages during rework.

Alpha Coolcap devices sit on the PCB over the component to be protected during lead-free reflow and rework and will not create solder bridges, solder balls or other related process defects.

ALPHA CoolCap testing was performed on a lead-free compatible Speedline OmniExcel 7 reflow oven.

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