Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Cookson Electronics | Subject: XB3
Edited by the Electronicstalk Editorial
Team on 10 November 2005
Next dimension in substrate and wafer
bumping
Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed.
Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed, resulting in higher throughput, and the flexibility to deposit complex alloys, including lead-free It can also handle a wide dynamic range of size and pitch
This article was originally published on Electronicstalk on 15 Sep 2005 at 8.00am (UK)
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"XB3 utilises an electrokinetic process to deposit particles of material by creating local electrical fields across the surface of a wafer", said Mike Marczi, Cookson Electronics' Director of Business Development.
"This approach provides the speed and flexibility far exceeding any other deposition technology available today".
XB3 technology offers substrate and wafer bumping speeds 100 times faster than traditional plating averaging 20 seconds versus 40 minutes elapsed time.
Its ability to deposit a wide range of multi-component alloys, including common lead-free alternatives, such as SAC305 in powder or sphere format, demonstrates its flexibility.
XB3's wide dynamic range allows it to keep pace with today's rapidly accelerating technology trend requirements where it can handle down to 40 micron deposits on 80 micron pitch and spheres as large as 400 microns.
The XB3 process is broken down into four basic steps as follows, 1) wafers are prepared using traditional photo-mask techniques to produce the desired pattern, 2) wafers are then picked up by a dual purpose robotic arm that makes electrical contact with the wafer's bus metallisation and serves as the counter electrode creating a voltage potential, 3) the robotic arm is then immersed in a fluidised bed of solder particles, and 4) the voltage gradient between the counter electrode and the wafer UBM drives the particles to the surface of the wafer.
Once the deposition is complete, the wafer is removed from the fluidised bed where it then receives a light mist of flux before going through a reflow oven. Request a free brochure from Cookson Electronics ...
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