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Paste keeps pins clean for testing

A Cookson Electronics product story
Edited by the Electronicstalk editorial team May 15, 2006

Lead-free no-clean solder paste promises unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.

Cookson Electronics Assembly Materials is pleased to announce the launch of its Alpha OM-338 PT lead-free no-clean solder paste.

This new product offers unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.

"Lead-free pastes have an inherent difficulty with pin test yields".

"Thanks to our global market intelligence gathering, and world class team of product formulators, OM-338 PT has proven to be a very promising innovation", said Mitch Holtzer, Cookson Electronics' Global Product Manager.

"Alpha OM-338 PT is targeted to both EMS and OEM customers using inline circuit testing".

"OM-338PT was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield".

Alpha OM-338 PT lead-free no-clean solder paste is the right product for electronics manufacturers who are currently dissatisfied with their lead-free paste selection, or who have yet to make a decision as the RoHS compliance deadline of 1st July 2006 approaches.

In addition to excellent pin testability with virtually no residue on pins, OM-338 PT offers high print speeds (up to 150mm/s, on 12mil squares and 10mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colourless flux residue yielding excellent joint appearance, and excellent low voiding and antislumping characteristics.

Find out more about this article. Request a brochure, download technical specifications and request samples here.

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