Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Cookson Electronics
Edited by the Electronicstalk Editorial
Team on 11 August 2006
New group integrates extensive knowledge
base
Cookson Electronics Assembly Materials has set up its Global Applications Technology and Engineering group, which joins its global R and D group.
Cookson Electronics Assembly Materials has set up its Global Applications Technology and Engineering group, which joins its global R and D group This effort formally integrates the extensive knowledge base of the company's field engineer network into its vast internal applications structure
This article was originally published on Electronicstalk on 15 Sep 2005 at 8.00am (UK)
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The mission of this dedicated group is to assist Cookson's customers in solving their assembly technology, yield and reliability challenges through the utilisation of Cookson's integrated understanding of process dynamics, and its expert internal testing and validation capabilities.
"The formation of the Global Applications Technology and Engineering group gives Cookson Electronics the ability to increase its development and output of process engineering expertise into the world of electronics manufacturing", said Steve Brown, Cookson's Director of Global Applications Technology.
"This new group has been formed at a time when assemblers are continually finding new practical challenges in assembly processes, as lead-free production becomes a daily reality".
"At the disposal of the group is our a global team of field applications engineers along with two fully automated SMT and wave soldering lines, with automatic solder paste inspection".
"This capability enables us to recreate and solve process problems from within Cookson Electronics labs, by using either Cookson test vehicles or customer specific PWBs".
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