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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Cookson Electronics | Subject: Alpha OM-350
Edited by the Electronicstalk Editorial Team on 25 February 2008

Pb-free paste survives under the bonnet

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Alpha OM-350 with InnoLot alloy has been developed to meet the growing demand for a more robust alloy that provides superior and reliable solder joints.

Cookson Electronics Assembly Materials has developed a new automotive-grade Pb-free solder paste primarily for "under-the-bonnet" applications Alpha OM-350 with InnoLot alloy has been developed to meet the growing demand for a more robust alloy that provides superior and reliable solder joints, even when these joints are exposed to extreme conditions, such as the high temperatures and vibration that is becoming the norm for engine-mounted modules

In consortium sponsored studies, where assemblies were subjected to extreme thermal cycling under vibration, solder joints made with Alpha OM-350 with InnoLot alloy showed improved resistance to mechanical failure compared with SAC 387.

"We are responding to the automotive industry need to increase electronic system reliability while decreasing the weight and complexity of wiring harnesses", says Cookson Electronics' Global Product Manager, Mitch Holtzer.

Alpha OM-350 with InnoLot alloy shows improved performance over SAC 387 based lead free solder, which can be important in applications like engine-mounted control modules where extreme temperature variations and vibration are commonplace".

InnoLot Alloy is a patented, six-part alloy with a reduced melting point compared with SAC 305, and is already being tested at a number of the large automotive electronics producers around the globe.

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