WS-820 solder paste offers good printability
A
Cookson Electronics product story
Edited by the Electronicstalk editorial team
May 27, 2009
Alpha - Cookson Electronics Assembly Materials has launched the Alpha WS-820 halide-free, lead-free, water-soluble solder paste.
The company said the product offers excellent printability with good print volume and print repeatability down to 12 mil (0.3mm) features.
Alpha - Cookson Electronics Assembly Materials has launched the Alpha WS-820 halide-free, lead-free, water-soluble solder paste.
It also has a good reflow process window with straight ramp and short soak or long soak profiles in air.
WS-820 is designed to provide excellent print performance at both low and high relative humidity (20-65 per cent), and it offers IPC 7095 Class III resistance to voiding.
It is also easy to clean with warm de-ionised water, leaving virtually no ionic contamination behind Available in SAC305 and SAC405 alloys and in Type 3 and 4 powder, Alpha WS-820 delivers good wetting characteristics on all common surface finishes, including Entek HT OSP.
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