Solder paste improves print cycle time

Cookson Electronics has launched Alpha CVP-360 Pb-free, no-clean solder paste formulated with its economical low-Ag SACX 0807 and 0307 alloys.

'By enabling the use of lower silver SACX alloys, CVP-360 can virtually eliminate the price volatility of silver, without eliminating the soldering benefits of silver from the alloy,' said Mitch Holtzer, Cookson's global product manager.

'CVP-360 also offers value with extremely high in-circuit pin test yields, and superior spread and wetting versus leading SAC 305 and SAC 405 solder pastes,' he added.

Alpha CVP-360 is claimed to deliver excellent printing characteristics allowing for the use of more economical Type-3 solder powder, even when 12 mil (300 micron) features are being printed using a five mil thick (125 micron) stencil.

CVP-360 also allows high-speed printing and reduced stencil cleaning frequency.

This reduces the print cycle time, and lowers the cost of consumables, such as stencil cleaner and under-wipe paper.

CVP-360 also has a wide reflow process window, which indicates resistance to head-in-pillow defects.

This can also make a difference if older, or lower-cost substrates and components are used.

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