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Thermal grease improves heat dissipation

Edited by the Electronicstalk editorial team Feb 20, 2006

NanoFusion is a novel thermal grease compound claimed to offer the best cooling and overclocking performance with the thinnest amount of compound between the heatsink and CPU.

Available from CoolerMaster, NanoFusion is a novel thermal grease compound claimed to offer the best cooling and overclocking performance with the thinnest amount of compound between the heatsink and CPU.

With a bond line thickness (BLT) of only 0.019mm, NanoFusion delivers thermal conductivity of 7.8W/m-K to lower CPU temperatures more efficiently.

And with a specific gravity of 3.25, NanoFusion out performs other heavier thermal grease compounds currently available.

NanoFusion is environmentally safe and RoHS compliant.

And because it is made of electrically nonconductive material, there is no risk of accidents caused by short circuiting.

The tiny but powerful NanoFusion is set to lead the way as the most efficient heat conductor that ensures the best results for PC overclockers.

NanoFusion thermal compound is available at a recommended retail price of GBP 6.50 per syringe, including VAT and has a 24 month shelf life from date of manufacture.