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    <title>RSS News Feed for CPS Corp - from Electronicstalk</title>
    <link>http://www.electronicstalk.com/news/csc/csc000.html</link>
    <description>CPS Corp news releases on Electronicstalk</description>
    <language>en-gb</language>
    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Sat, 22 Nov 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Sat, 22 Nov 2008 08:00:00 UT</lastBuildDate>
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      <title>Pro-Talk Ltd</title>
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    <item>
      <title>Composite material for high-power cooling fins</title>
      <description>AlSiC (Aluminum Silicon Carbide) from CPS Corporation is a metal matrix composite that enables  cost-effective integration of cooling pin fins for high-power applications.</description>
      <pubDate>Fri, 09 Feb 2007 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc114.html</link>
    </item>
    <item>
      <title>Composite cools flip-chip packages</title>
      <description>Metal matrix composite provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.</description>
      <pubDate>Tue, 09 Jan 2007 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc113.html</link>
    </item>
    <item>
      <title>Metal matrix composite is RoHS compliant</title>
      <description>AlSiC metal matrix composite is ideally suited for thermal management solutions for high brightness LEDs.</description>
      <pubDate>Tue, 14 Mar 2006 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc111.html</link>
    </item>
    <item>
      <title>MPU package lids build in thermal management</title>
      <description>Aluminium silicon carbide metal matrix composite materials meet the material property, design and pricing demands for MPU assemblies that require integrated heatsink thermal management solutions.</description>
      <pubDate>Thu, 15 Dec 2005 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc110.html</link>
    </item>
    <item>
      <title>Patented tubing promises active cooling solutions</title>
      <description>CPS has recently been awarded a patent for tubing integrally enveloped within AlSiC thermal management composite materials for active cooling solutions.</description>
      <pubDate>Mon, 15 Aug 2005 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc109.html</link>
    </item>
    <item>
      <title>Composite makes ideal housing for opto devices</title>
      <description>AlSiC (aluminium silicon carbide) metal matrix composite is ideally suited for optoelectronic housings and lids.</description>
      <pubDate>Tue, 03 May 2005 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc106.html</link>
    </item>
    <item>
      <title>Metal matrix makes IGBT baseplates</title>
      <description>The AlSiC (aluminium silicon carbide) metal matrix composite from CPS Corp is ideally suited as a thermal management material for insulated gate bipolar transistor (IGBT) baseplates.</description>
      <pubDate>Tue, 03 May 2005 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc107.html</link>
    </item>
    <item>
      <title>Composite is cool solution for high-power LEDs</title>
      <description>Metal matrix composite is ideal for thermal management of high flux LED products, such as signal lamps, backlighting for signs, low profile luminaires, task lighting and display lighting.</description>
      <pubDate>Tue, 01 Mar 2005 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc104.html</link>
    </item>
    <item>
      <title>Composite promises cost-effective military cooling</title>
      <description>AlSiC (aluminium silicon carbide) metal matrix composite is ideal for applications in military electronics.</description>
      <pubDate>Tue, 01 Mar 2005 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc105.html</link>
    </item>
    <item>
      <title>Substrates improve thermal management</title>
      <description>AlSiC (aluminium silicon carbide) substrates from CPS Corp are ideal for power supply substrate applications, including carrier plates and heatsink materials for medical equipment power supplies.</description>
      <pubDate>Wed, 22 Dec 2004 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc103.html</link>
    </item>
    <item>
      <title>Thermal inserts reduce cost and space requirements</title>
      <description>AlSiC (aluminium silicon carbide) metal matrix composite is ideal for military and defence electronics.</description>
      <pubDate>Tue, 10 Aug 2004 08:00:00 UT</pubDate>
      <category>CPS Corp</category>
      <link>http://www.electronicstalk.com/news/csc/csc100.html</link>
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