Product category:
Heatsinks and Thermal Management
News Release from: CPS Corp | Subject: AlSiC substrates
Edited by the Electronicstalk Editorial
Team on 22 December 2004
Substrates improve thermal management
AlSiC (aluminium silicon carbide) substrates from CPS Corp are ideal for power supply substrate applications, including carrier plates and heatsink materials for medical equipment power supplies.
AlSiC (aluminium silicon carbide) substrates from CPS Corp are ideal for power supply substrate applications, including carrier plates and heatsink materials for medical equipment power supplies AlSiC applications include electronic detectors in NMRI and MRI systems and high-rotational-speed elements in CT scanners
This article was originally published on Electronicstalk on 10 Aug 2004 at 8.00am (UK)
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Metal matrix composite is ideal for thermal management of high flux LED products, such as signal lamps, backlighting for signs, low profile luminaires, task lighting and display lighting.
AlSiC metal matrix composite offers high strength and stiffness and low density, making it ideal for electronic packaging applications that are weight sensitive, require low inertial response, or are tolerant to high vibration.
AlSiC replaces traditional power substrate materials, such as copper.
Its high thermal conductivity and coefficient of thermal expansion (CTE) matching ensure device reliability, surviving tens of thousands of thermal cycles without delamination, cracking between the attached heat generating IC devices or dielectric substrates.
AlSiC's CTE can be adjusted for specific applications, allowing IC direct attachment by eliminating the need for thermal stress compensating interface layers that increase thermal resistance.
CPS' net-shape fabrication process both produces the composite material and fabricates the product geometry, including through-hole and threaded hole features.
This cost-effective process allows tight tolerances without the need for expensive machining and provides high volume assembly yields.
The unique casting process also enables integration of very high thermal conductivity inserts (above 1000W/mK) or cooling tubes for more advanced thermal management solutions.
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