Product category:
Heatsinks and Thermal Management
News Release from: CPS Corp | Subject: AlSiC
Edited by the Electronicstalk Editorial
Team on 09 January 2007
Composite cools flip-chip packages
Metal matrix composite provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.
AlSiC (aluminium silicon carbide) metal matrix composite provides high-performance lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market AlSiC has been tested and meets the requirements of the Restriction of Hazardous Substances Directive (RoHs compliant) of the European Parliament
This article was originally published on Electronicstalk on 10 Aug 2004 at 8.00am (UK)
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AlSiC (aluminium silicon carbide) metal matrix composite is ideal for military and defence electronics.
Substrates improve thermal management
AlSiC (aluminium silicon carbide) substrates from CPS Corp are ideal for power supply substrate applications, including carrier plates and heatsink materials for medical equipment power supplies.
Ideal for flip-chip lid applications, AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies.
Unlike traditional packaging materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio.
AlSiC's CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field.
AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation.
Coupled with its superior CTE matching, AlSiC's high thermal conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure.
Traditional packaging materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.
The CPS AlSiC net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions.
Less dense than traditional flip-chip packaging materials, AlSiC provides assembly yields at the customer level.
The unrestricted geometry of AlSiC enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids.
The AlSiC cast surface supports various identification methods including, laser marking, paint, ink, and screen printing, as well as plating anodisation and other surface metallisation schemes typically applied to aluminium.
The unique casting process also enables integration of very high thermal conductivity inserts (better than 1000W/mK) or cooling tubes for more advanced thermal management solutions.
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