Product category:
Embedded Computing and Control
News Release from: CommAgility | Subject: AMC-D1F1-1200
Edited by the Electronicstalk Editorial
Team on 01 April 2008
Module squeezes large bandwidth into
small package
The AMC-D1F1-1200 provides a combination of DSP and FPGA resources, with fast and flexible links to external data and over 256Mbyte of onboard memory.
CommAgility has released the AMC-D1F1-1200 mid-size AdvancedMC module, which includes a Texas Instruments (TI) TMS320C6455 digital signal processor (DSP) running at 1.2GHz and a Virtex-4 FX100 FPGA from Xilinx The AMC-D1F1-1200 is optimised for applications requiring high-end signal I/O bandwidth in a compact mid-height AMC form factor, such as wireless baseband, image processing, defence and aerospace applications
This article was originally published on Electronicstalk on 1 Feb 2008 at 8.00am (UK)
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AdvancedMC module sports four top-speed DSPs
Module is optimised for applications requiring high-end signal processing, such as wireless baseband image processing, defence and aerospace applications.
Small mezzanine card packs in bandwidth
The AMC-6487C includes three software programmable TCI6487 DSPs, each containing three high-performance C64x+ cores running at 1GHz as well as 3Mbyte of on-chip memory.
Using the fastest available DSP with a large FPGA enables an application to be balanced and optimised for the most effective use of resources and development time.
The AMC-D1F1-1200 provides a combination of DSP and FPGA resources, with fast and flexible links to external data and over 256Mbyte of onboard memory.
The FPGA is directly connected to the DSP via a high-bandwidth, low-latency 64bit, 150MHz local (EMIF) bus to facilitate co-processing.
The processor elements are also interconnected by a 10Gbit/s SRIO infrastructure with external connectivity to an AMC.4 backplane interface and front panel connector.
An AMC.2 Gigabit Ethernet interface is also supported.
For applications requiring custom I/O or specialised additional processing, a mezzanine module can be fitted to the AMC-D1F1-1200.
The mezzanine can include front panel connectors as well as direct interfaces to Ethernet, SRIO and the FPGA.
The new module is based on the AdvancedMC embedded standard, making it suitable for use in MicroTCA and AdvancedTCA systems.
The product is designed to be used in NEBS and ETSI-compliant systems.
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