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3D simulation handles larger structures

A CST - Computer Simulation Technology product story
Edited by the Electronicstalk editorial team Jun 12, 2006

A new tool for the 3D EM simulation of electrically large structures has been added to CST Microwave Studio.

Computer Simulation Technology (CST) is previewing a new tool for the 3D EM simulation of electrically large structures at MTT-S IMS 2006, Booth 1329.

The new integral equation solver, based on the multilevel fast multipole method (MLFMM), joins CST Microwave Studio (CST MWS)'s transient and frequency domain solvers for high frequency applications and will be available in Q3 of 2006.

The newly implemented integral equation solver opens up new possibilities to design engineers engaged in areas such as automotive, aerospace and defence and EMC in terms of structure sise.

Its main area of usage will be the solving of structures much larger than 20 wavelengths and is of particular interest because of its ability to deal with dielectric losses.

Typical application examples include antenna placement on an airplane and radar cross section (RCS) calculations of large scattering objects.

As with all solvers in CST Studio Suite, its integration in CST Design Environment is seamless and based on the same easy to use modeller and front end.

"The addition of our new Integral Equation solver to CST Studio Suite ensures that design engineers dealing with electrically large structures can efficiently calculate highly accurate solutions, keeping them at the forefront of product development", commented Dr Peter Thoma, CST's Managing Director, R and D.

"Traditional MoM solvers generally suffer from poor scalability in terms of memory requirements and computation time whereas CST's new integral equation solver offers the inbuilt advantages of the MLFMM approach".

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