Benchtop AOI system speeds board throughput

Benchtop automated optical inspection system provides the highest defect coverage available from any benchtop solution.

Cupio's new YesTech B3 benchtop automated optical inspection system provides the highest defect coverage available from any benchtop solution.

Employing Thin Camera technology and designed for populated printed circuit boards, it inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

The B3 will be introduced into Europe at the Nepcon 2007 exhibition.

The system achieves its performance through a threefold improvement in inspection speed, new Fusion Lighting and advanced image processing technology.

It also features enhanced board handling in an aesthetically updated new package as well as complete software and board setup compatibility with YesTech's complete line of AOI systems.

Programming is fast and intuitive.

An operator typically takes less than 30 minutes to create a complete inspection program including solder joints.

The B3 uses a standard package library to simplify training and ensure program portability across manufacturing lines.

The newly available image processing technology integrates several techniques, including colour, normalised correlation and rule-based algorithms to provide complete inspection coverage with extremely low false failure rates.

"The new YTV B3 benchtop AOI offers faster throughput, enhanced board handling, and other enhancements to further improve the YesTech advantage in cost/performance and customer ROI", said Troy Johnson, YesTech's VP of Sales.

"The B3 is equally effective for pre/post-reflow or even final assembly inspection".

"Remote programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution", concluded Johnson.

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