Product category:
Electronics Manufacturing Services
News Release from: CIL Custom Interconnect | Subject: Bare chip assembly capability
Edited by the Electronicstalk Editorial
Team on 18 February 2002
Manufacturer expands bare chip assembly
Custom Interconnect has extended its bare chip assembly capability for both chip on board (COB) and multichip module (MCM) fabrication.
Custom Interconnect has extended its bare chip assembly capability for both chip on board (COB) and multichip module (MCM) fabrication CIL has been carrying out COB work for over six years and has now built up one of the most extensive facilities of its type in the UK
This article was originally published on Electronicstalk on 2 Jul 2004 at 8.00am (UK)
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From silicon die to full custom BGA assembly
CIL now has the capability to provide the full production process from silicon die to custom ball grid array (BGA) assembly.
New, state-of-the-art machines have been added to the existing facility to cater for the finer pitch and pad sizes now used in modern die and wire bonding techniques.
The new automatic die bonder uses an advanced video pattern recognition system that enables placement of the die and other micro components to an accuracy of 30 microns.
This is a key requirement in many of the sensor and optoelectronics applications.
Other additions are a high-speed wire bonder and a robotic glob top assembly machine.
There has also been a major overhaul and extension to the clean room facility.
This investment will cater for growth in this area of manufacturing, increasing both capacity and capability.
It will allow CIL to undertake more taxing and complex production processes and increase productivity while improving production yields and product reliability.
Chief executive of CIL, Nick Edwards, said: "Since CIL was formed in 1987, we have built up a reputation in leading edge technologies to provide an expert design service and volume manufacturing capability.
We provide our customers with a bridge between design and manufacture across a very broad band of technologies.
This latest investment means that we will improve our capability in all processes involved in chip on board manufacture and this complements our advanced surface mount capability meaning that we now offer a high level of automation across a wide range of production techniques".
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