From silicon die to full custom BGA assembly

CIL now has the capability to provide the full production process from silicon die to custom ball grid array (BGA) assembly.

CIL now has the capability to provide the full production process from silicon die to custom ball grid array (BGA) assembly.

Customers can now present CIL with a silicon die and be supplied with a custom BGA SMT placed on a fully tested PCB assembly.

Using CAD, CIL is able to custom design the BGA substrate in either laminate or ceramic technologies and reflow solder the solder balls using a process that has been developed in-house.

The bare die or multiple dies are attached to the substrate using aluminium wire bonds with wire counts of up to 1000.

The bare die and wire bonds are then protected with a combination of glob top using a "dam and fill" process.

This process allows CIL to fully test the finished BGA assembly and is particularly suited to customers that cannot supply 100% guaranteed good die for chip-on-board (COB) applications.

CIL is also able to mount the BGA package onto customers PCB assemblies using one of its three "state of the art" SMT lines.

This will soon be backed up with in-house X-ray inspection.

BGA technology is ideal for high-density boards and offers the great advantage that the array can be packaged and then tested prior to mounting on the PCB.

Managing Director, John Boston, believes that CIL is the only company in the UK that can provide this total process and is convinced that this service will be attractive to customers both in the UK and overseas.

"We already have a number of customers using this method and are developing further enhancements".

"Some customers are finding it particularly useful with component obsolescence, where packaged parts have gone obsolete but the die is still available".

"CIL are able to process the die and manufacture a BGA package solution on a relatively short lead time".

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