New machine boosts wire bonding capabilities

CIL has installed another new aluminium wire bonder that is designed to meet the demands of the latest techniques required in die and wire bonding.

Whitchurch based electronics manufacturing and design company CIL has installed another new aluminium wire bonder that is designed to meet the demands of the latest techniques required in die and wire bonding.

The new ASM559A machine incorporates all the latest technology and with a 60-degree wire feed is able to wire bond deep access applications.

John Boston, Managing Director at CIL, said: "It has been our policy over the past two years to concentrate on niche areas where 'state of the art' wire bonding is required".

"Existing machines of just a few years old cannot cope with the accuracy required when working with some modern die".

"Neither can they handle the techniques used in applications such as LED technology and ultra-fine-pitch high-wire-bond-count applications".

"The field of optoelectronics is becoming increasingly important to us".

"We are now designing, die bonding, wire bonding, encapsulating and testing high-density LED die for this market, and to remain competitive it is vital to invest in the latest equipment".

"These new wire bonders are capable of bonding three wires a second on a 90um pitch with up to 1000 off wires per device and this capability is opening opportunities to CIL because other suppliers cannot compete with this level of accuracy".

"We now have an increasing number of customers who are using our die bond, wire bond, micropackaging and full SMT build capability on three brand new surface mount lines to develop and manufacture very advanced products".

"These products are adding to our customers' growth and also significantly contributing to our own".

This is the second new aluminium wire bonder that CIL has installed in the past two years and the company plans to install a new automatic gold ball bonder in the next three months.

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