Product category:
Electronics Manufacturing Services
News Release from: Cypress Semiconductor
Edited by the Electronicstalk Editorial
Team on 18 April 2005
Advanced SoI process set for
commercialisation
American Semiconductor will use manufacturing services from Silicon Valley Technology Center to commercialise its Flexfet advanced SoI CMOS wafer fabrication process.
American Semiconductor (ASI) has chosen to use manufacturing services from Silicon Valley Technology Centre (SVTC), a division of Cypress Semiconductor Corp, to commercialise its Flexfet advanced silicon-on-insulator (SoI) CMOS wafer fabrication process for manufacturing ASI, a fabless semiconductor company that develops and commercialises process technology, is avoiding significant capital investment by using SVTC's 65nm-capable, 200 and 300mm R and D wafer fab, to develop and qualify its process technology
This article was originally published on Electronicstalk on 7 Feb 2001 at 8.00am (UK)
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"By perfecting our technology at SVTC, ASI is able to resolve fundamental limitations of CMOS for next-generation scaling of advanced microelectronics", said Doug Hackler, founder and President of ASI.
"We are also able to cost-effectively move our business forward and more aggressively pursue and support our customer base".
Flexfet is a new process that supports a variety of technologies, such as novel dielectrics, metal gate materials, 3D and MEMS integration, all beyond the scope of standard CMOS capabilities.
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The process provides a significant advancement in dynamic threshold control that reduces the scaling barriers associated with power.
It is also RF-capable, inherently resistant to radiation and allows low power operations well below 1V.
"As R and D costs continue to rise, companies with emerging technology development needs, capital equipment manufacturers and materials suppliers are challenged to cost-effectively migrate their products and processes from prototype to manufacturability", said Bert Bruggeman, SVTC's Managing Director.
"Our work with ASI is an example of how to overcome those challenges and allows ASI to realise a significant R and D cost savings while rapidly commercialising its advanced process technology".
SVTC's 200mm wafer fab will support ASI's immediate demand for the Flexfet offering and prototype production is booked for Summer 2005.
Production volumes are forecast to be manufactured at Cypress's Bloomington, Minnesota-based Fab IV facility.
SVTC is also supporting ASI's requirements to scale the initial 0.18 micron offering to 0.13-micron, 90nm and beyond.
Cypress's SVTC enables third-party engineering groups to take products from proof-of-concept to manufacturing through a state-of-the-art toolset in a 1500m2 clean room in Silicon Valley.
Customers are also able to tap more than 20 years of process development expertise.
SVTC offers best practices in fab process engineering, statistical process control, quality management, failure analysis, and design for manufacturing methodologies as part of its development toolbox.
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