Image sensor scoops innovation award
Semiconductor Insights has named the IM103 one-third-inch VGA-format CMOS image sensor the winner of the 2006 Insight Award for Most Innovative Image Sensor.
Semiconductor Insights (SI) has named Cypress Semiconductor Corp's IM103 one-third-inch VGA-format CMOS image sensor the winner of the 2006 Insight Award for Most Innovative Image Sensor.
"Acquiring images for display on LCD monitors to show a driver obstacles behind the vehicle, requires very little in terms of either sensor performance or system intelligence", said Dr Don Scansen, Lead Technology Analyst for Image Sensors at Semiconductor Insights.
"However, Cypress is developing very high performance imaging products that allow the car to decide for itself when a dangerous situation arises".
"Instead of using an existing image sensor, Cypress created a complete solution for control of wide dynamic range thereby easing implementation for system integrators in machine vision applications".
"We are pleased with Semiconductor Insights' recognition of Cypress's IM103 image sensor for machine vision applications", said Rich Hicks, Director of the Automotive Imaging Business Unit for Cypress.
"Back up cameras currently account for 90-95% of the automotive image sensor market, but machine vision sensors will close the gap as computing power becomes cheaper".
SI's recent analysis of Cypress's IM103 one-third-inch VGA-format CMOS image sensor (CYIA2SC0300AA) revealed an 8 x 8um pixel with a high maximum sensitivity.
"The image sensor has an effective pixel density of 7100 pixels per square millimetre which is very good for an automotive sensor", said Scansen.
"As opposed to regular image sensors, the fill factor depends only on geometry for automotive since microlens materials cannot meet the environmental specifications for automotive applications".
"We measured the fill factor at 57%, which is an excellent level for a CMOS image sensor that provides a photodiode of more than 36um2".
"The Cypress design team also streamlined the control circuitry to achieve a die efficiency of 47%".
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