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Product category: Communications ICs (Wired)
News Release from: Cypress Semiconductor
Edited by the Electronicstalk Editorial Team on 10 April 2007

Nonvolatile SRAMs receive Chinese award

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Cypress Semiconductor's nonvolatile SRAMs (nvSRAMs) have been named Product of the Year in the Memory category of Global Source's EE Times-China Annual Creativity in Electronics (ACE) Awards.

Cypress Semiconductor's nonvolatile SRAMs (nvSRAMs) have been named Product of the Year in the Memory category of Global Source's EE Times-China Annual Creativity in Electronics (ACE) Awards The Products of the Year recognise leadership and excellence in product design, with awards going to the product or technology that significantly impacts or has a potential to impact mainland China's electronics market

Winners were chosen by a panel of industry experts and were announced at a gala coinciding with the 12th International IC-China Conference and Exhibition (IIC-China 2007).

Cypress nvSRAMs internally store data when power is lost, with no battery required.

The elimination of the external battery enables Cypress to deliver the RoHS-compliant, high-speed devices in smaller packages than alternative solutions.

The nvSRAMs are ideal for any application requiring continuous high-speed writing of data and absolute nonvolatile data security, such as RAID (Redundant Array of Independent Disks) applications, copiers, PoS terminals, handheld meters, and consumer electronics products.

These nvSRAMs are the first in a family of devices being developed pursuant to Cypress' previously announced agreements with Simtek Corporation, the inventor and pioneer of nvSRAMs.

"China is an important market for Cypress nvSRAMs, and we are pleased to have our technology recognised by EE Times-China", said Tom Surrette, Vice President of the Nonvolatile Memory business unit for Cypress.

"Customers have quickly recognised the advantages of nonvolatile SRAMs over battery-backed solutions due to their infinite high speed write capabilities, RoHS compliance, ease of board layout and integration into the manufacturing flow".

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