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Datacon Semiconductor Equipment
Innstrasse 16
A-6240 Radfeld
Austria
Latest articles from this company
News releases from this company
Datacon goes direct in USA and Asia
Datacon Technology is reorganising its international operations with direct subsidiaries in the USA and Asia.
News from Electronicstalk, 20 March 2002
Loader keeps wafers moving
Datacon's new stackloader STL2 fits into its modular die bonder concept and can be configured with the 2200 apm, 2200 apm+ and EWR.
News from Electronicstalk, 4 October 2001
Multichip die bonder ready for 300mm wafers
Datacon has released its next generation multichip die bonder.
News from Electronicstalk, 3 October 2001
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