Product category:
IC and Hybrid Processing Equipment
News Release from: Datacon Semiconductor Equipment | Subject: 2200 apm+
Edited by the Electronicstalk Editorial
Team on 03 October 2001
Multichip die bonder ready for 300mm
wafers
Datacon has released its next generation multichip die bonder.
Datacon has released its next generation multichip die bonder The 2200 apm+ is an extension of the proven modular platform concept for advanced packaging, offering 300mm wafer handling
This article was originally published on Electronicstalk on 4 Oct 2001 at 8.00am (UK)
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"With this system, Datacon offers its customers all the advantages of the 2200 apm, with new support for 300mm wafer processing", states Harald Korber, Head of Product Management.
"The semiconductor industry is now moving strongly towards on the use of 300mm wafers.
The transition towards 300mm will also significantly impact packaging and assembly.
New advanced packaging systems have to be capable of handling these large processed wafers.
The multi chip die bonder 2200 apm+ is ready for this transition, and is built on the same concept as our proven 2200 apm system, capable of handling 300mm wafers for large dies up to 50mm for die attach and flip chip.
As a flip chip pioneer from the beginning, Datacon offers this future oriented technology as the first of its kind on the market also for 300mm wafer processing with the 2200 apm+".
The new generation of die bonders integrates seamlessly into the unique modular platform concept, ensuring maximum flexibility and reliability for the future.
"Our new system gives our customers the security that their equipment investment is capable of supporting current and future market requirements", commented Korber.
With today's set of advanced packaging requirements, more and more assembly lines require a large degree of modularity.
Different modules can be arranged consecutively, so that either the throughput can be multiplied or all kinds of different tasks can be processed in parallel.
The flexibility of the 2200 apm+ is reflected in the full MCM capability by automatic wafer changing, automatic tool changing, multichip ejector carrousel system, die attach and flip-chip capabilities, and its compliance with the Semi SECS standards.
Despite this high degree of modularity and the small extension to handle 300mm wafers, the 2200 apm + is still the die bonder with the smallest footprint in its class.
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