Product category:
IC and Hybrid Processing Equipment
News Release from: Datacon Semiconductor Equipment | Subject: STL2
Edited by the Electronicstalk Editorial
Team on 04 October 2001
Loader keeps wafers moving
Datacon's new stackloader STL2 fits into its modular die bonder concept and can be configured with the 2200 apm, 2200 apm+ and EWR.
Datacon's new stackloader STL2 fits into its modular die bonder concept and can be configured with the 2200 apm, 2200 apm+ and EWR "The STL2 has the capability to handle BGA strips, lead frames, ceramic strips as well as FR4 substrates", states Harald Korber (Datacon Product Management)
This article was originally published on Electronicstalk on 3 Oct 2001 at 8.00am (UK)
Related stories
Multichip die bonder ready for 300mm wafers
Datacon has released its next generation multichip die bonder.
Foils developed for large frameless stencils
DEK has extended its VectorGuard to 29" by 29" - a convenient new frameless foil system that is said to be set to revolutionize large format applications.
Large formats get frameless foil system
DEK has added large foils to its range of VectorGuard stencils, allowing customers to reduce changeover time and ease stencil handling and storage challenges in large image area applications.
Semiconductor manufacturers more and more put stringent demands on how the equipment should be manufactured and integrated into their assembly lines.
Flexibility becomes one of the key issues as back-end subcontractors need to be able to provide many different advanced packaging solutions in very short cycle times.
This can only be done if assembly lines are built up of highly modular assembly systems.
"Datacon specifically targets those issues by adding more flexibility and functionality to its assembly systems.
The stackloader STL2 is another step in that direction".
The STL2 is full automatic and easy to run.
Operation starts with placing the trays on the conveyer of the stackloader.
The conveyer can be used as a buffer line for up to six trays depending on the substrate size.
A pickup head takes a strip out of the tray on the transport system of the stackloader and places interleave material into the empty tray on the conveyer.
"This new stackloader is easy to use and can handle most types of substrates", according to Harald K?rber.
"It is specifically designed to fit into the highly modular 2200 apm concept, and yet exhibit high throughputs".
• Datacon Semiconductor Equipment: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
