<?xml version="1.0" encoding="iso-8859-1"?>
<rss version="2.0">
  <channel>
    <title>RSS News Feed for DEK - from Electronicstalk</title>
    <link>http://www.electronicstalk.com/news/dek/dek000.html</link>
    <description>DEK news releases on Electronicstalk</description>
    <language>en-gb</language>
    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Tue, 29 Jul 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Tue, 29 Jul 2008 08:00:00 UT</lastBuildDate>
    <image>
      <title>Pro-Talk Ltd</title>
      <url>http://www.pro-talk.com/images/protalklogo90.gif</url>
      <link>http://www.pro-talk.com/</link>
      <width>90</width>
      <height>79</height>
    </image>
    <item>
      <title>Print platforms add features and performance</title>
      <description>DEK has added a number of performance and productivity improvements to its Horizon product line.</description>
      <pubDate>Wed, 28 May 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek280.html</link>
    </item>
    <item>
      <title>Screen service provides fast delivery</title>
      <description>Manufacturers of PV cells can combine DEK's precision screens with printers from DEK or third-party suppliers.</description>
      <pubDate>Fri, 09 May 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek279.html</link>
    </item>
    <item>
      <title>Printing system upgrades materials deposition</title>
      <description>Enclosed head printing provides exceptionally efficient materials transfer, superior throughput rates, higher process yields, lower material consumption and improved process control.</description>
      <pubDate>Mon, 31 Mar 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek278.html</link>
    </item>
    <item>
      <title>Print platform handles large image sizes</title>
      <description>The Europa Vi can handle large board products up to 7.5kg in weight and 6mm thick and features heavy-duty remote board stops.</description>
      <pubDate>Tue, 25 Mar 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek277.html</link>
    </item>
    <item>
      <title>Software offers speedy verification</title>
      <description>HawkEye operates at the line beat rate, delivering a go/no-go indication for each board and isolating faulty boards in real-time. </description>
      <pubDate>Thu, 20 Mar 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek276.html</link>
    </item>
    <item>
      <title>SMT platform philosophy spawns solar cells</title>
      <description>DEK has developed a new range of highly modular PV cell manufacturing solutions to accommodate the demanding needs of the industry going forward.</description>
      <pubDate>Tue, 19 Feb 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek275.html</link>
    </item>
    <item>
      <title>Platform streamlines screen printing</title>
      <description>The Horizon 03i comes equipped with DEK's Instictiv user interface and the ISCAN control network, which supports a faster, lighter and more reliable bus system.</description>
      <pubDate>Fri, 18 Jan 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek274.html</link>
    </item>
    <item>
      <title>System doubles printing output</title>
      <description>DEK's new solution delivers full in-line production at high speed, while occupying a significantly reduced line footprint. </description>
      <pubDate>Wed, 31 Oct 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek273.html</link>
    </item>
    <item>
      <title>Printer handles tough substrates</title>
      <description>Reel-to-Reel printing delivers an accurate, cost-effective and versatile process solution to optimise complex and continuous assembly.</description>
      <pubDate>Tue, 16 Oct 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek272.html</link>
    </item>
    <item>
      <title>Tooling system offers fast setup</title>
      <description>HD Grid-Lok's 12mm pin pitch can be set up in seconds to provide complete and flexible board support.</description>
      <pubDate>Fri, 07 Sep 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek271.html</link>
    </item>
    <item>
      <title>Alliance targets solar cell manufacturing</title>
      <description>DEK and BTU's new alliance will be officially unveiled at the 22nd European Photovoltaic Solar Energy Conference.</description>
      <pubDate>Wed, 05 Sep 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek269.html</link>
    </item>
    <item>
      <title>Imaging company opens Chinese facility</title>
      <description>DEK has opened a state of the art manufacturing facility in Shenzhen, China as part of its ongoing strategic expansion programme in the region.</description>
      <pubDate>Fri, 31 Aug 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek268.html</link>
    </item>
    <item>
      <title>Shenzhen plant to play major global role</title>
      <description>A new state-of-the-art manufacturing facility in Shenzhen is expected to account for 50% of DEK's total worldwide production by the end of 2007.</description>
      <pubDate>Fri, 03 Aug 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek267.html</link>
    </item>
    <item>
      <title>Materials management is key to manufacturability</title>
      <description>Process-enabling system brings high volume production to products that might not otherwise be viable.</description>
      <pubDate>Thu, 12 Jul 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek266.html</link>
    </item>
    <item>
      <title>Carrier cuts down on alignment processes</title>
      <description>Novel substrate centring and carrier technology enables multiple component support and alignment during screen printing and all subsequent assembly processes.</description>
      <pubDate>Tue, 10 Jul 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek265.html</link>
    </item>
    <item>
      <title>Mounting process makes stencils easier to use</title>
      <description>Novel stencil system extends VectorGuard range to deliver enhanced manufacturing flexibility.</description>
      <pubDate>Mon, 21 May 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek264.html</link>
    </item>
  </channel>
</rss>
