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Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: ProFlow
Edited by the Electronicstalk Editorial Team on 05 October 2001

Improved printing on show in Munich

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The latest additions to DEK's ProFlow product family will break cover at Productronica this November.

The latest additions to DEK's ProFlow product family will break cover at Productronica this November First is a new dual-chamber transfer head aimed at processes requiring high paste or adhesive deposition volume

It is joined by an extensive range of wiper options and an enhanced "paste-low" sensor for greater paste usage.

The dual-chamber transfer head optimises the movement and conditioning of a large volume of paste or adhesive.

Conditioning the material inside the head prior to deposition is critical to process control, and the dual chamber head now makes processes such as pin in paste, PumpPrinting and step-repeat patterns easier and more repeatable at line speed.

DEK continues to offer the original single chamber head as the standard ProFlow configuration.

The broad selection of precision wipers, including stepped or flat titanium for use with metal stencils, or mylar for delicate surfaces such as emulsion screens and PumpPrint stencils, allows users to access the benefits of ProFlow DirEKt Imaging in many electronic applications.

The new ProFlow paste low sensor reduces paste wastage and allows precise user control via a micrometer scale calibrated in 0.5mm steps.

Data from field trials has shown paste wastage can now be reliably maintained within 4 to 8% of the total cassette volume.

Visitors to DEK at Hall no A4, Stand 305 will be able to witness the expanded ProFlow range and discuss the practical process benefits with DEK's technical specialists.

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