Product category:
PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Low-volume ProFlow transfer heads
Edited by the Electronicstalk Editorial
Team on 13 January 2003
Heads make the most of expensive
materials
A new series of low-volume ProFlow transfer heads reduces costs and enhances the precision of high-accuracy mass imaging using very small quantities of high-value materials.
DEK has introduced the first of a new series of low-volume ProFlow transfer heads that reduce costs and enhance the precision of high accuracy mass imaging using very small quantities of high value materials These include fine-particle, low-alpha solder pastes and high gold-content compounds used to create grid arrays and other features in advanced packages such as CSP and flip chip
This article was originally published on Electronicstalk on 28 May 2008 at 8.00am (UK)
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These new additions to the ProFlow range are explicitly designed to achieve high accuracy and repeatability in processes requiring individual deposits less than 200mg.
The new transfer head design achieves greater metering accuracy by reducing material pressure variation, and features a new, locking mechanical interface that ensures the assembly is held perfectly perpendicular to the stencil surface at all times.
This results in enhanced volume consistency of the deposited material.
The first low-volume head to be introduced was 180mm print width.
Its 91cm3 chamber reduces material waste caused by deterioration, and allows manufacturers to reduce their inventories of expensive materials that are typically consumed only slowly.
A range of low-volume transfer heads is now available to accommodate most product sizes..
The head is filled from a syringe, rather than by replacing a cassette, and is compatible with any platform equipped to accept the standard ProFlow transfer head and featuring the DEK SCAR software-controlled air regulator.
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