Product category:
PCB Assembly Equipment and Tools
News Release from: DEK
Edited by the Electronicstalk Editorial
Team on 18 June 2003
Pair to provide flip chip assembly
process
DEK and PacTech USA have formed a technology partnership that leverages the strengths of the two companies for high-volume, high-speed wafer processing and bumping solutions.
DEK and PacTech USA have formed a technology partnership that leverages the strengths of the two companies for high-volume, high-speed wafer processing and bumping solutions By combining PacTech's electroless under bump metallisation (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process
This article was originally published on Electronicstalk on 28 May 2008 at 8.00am (UK)
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PacTech USA is a sales and service subsidiary of PacTech, the world's leading wafer bumping and packaging subcontractor using electroless nickel/gold under bump metallisation (UBM) and a variety of solder bumping techniques.
Founded in 1995 as a spin-off of the Fraunhofer Institute and the Technical University of Berlin, PacTech provides full turnkey bumping process solutions: equipment, process technology transfer, bumping chemistry and wafer-level bumping services.
The fully automated, wet-chemical electroless production process assisted by PacTech's PacLine 2000 concept, a mass-production equipment with a throughput of 150 wafers per hour, creates a thin Ni/Au UBM layer on top of the wafer pad metallisation at a significantly lower cost than electroplating.
Further reading
Printing system upgrades materials deposition
Enclosed head printing provides exceptionally efficient materials transfer, superior throughput rates, higher process yields, lower material consumption and improved process control.
Print platform handles large image sizes
The Europa Vi can handle large board products up to 7.5kg in weight and 6mm thick and features heavy-duty remote board stops.
Software offers speedy verification
HawkEye operates at the line beat rate, delivering a go/no-go indication for each board and isolating faulty boards in real-time.
Wafer sizes range from 4 to 12in and pad metallisation may be aluminium or copper.
The electroless Ni/Au UBM process once combined with solder bumping techniques such as stencil printing, ball placement or as a tall UBM only meets the aggressive cost targets of smart card and smart label applications as well as the high reliability requirements of automotive microelectronic products and flip-chip-in-a-package applications such as CSP or wafer-level CSP.
DEK, the world's leading provider of advanced preplacement manufacturing solutions, provides ultra-fine-pitch mass imaging technologies that work in conjunction with PacTech's wafer processing systems to create a low-cost, high-volume production process for wafer-level flip chip assembly.
DEK's stencil printing platforms may be used to print solder paste patterns with a variety of solder alloys or, using Direkt Ball Placement, to place solder balls on PacTech-processed wafers.
Direkt Ball Placement uses DEK's patented ProFlow Direkt imaging technology to place solder balls as small as 0.3 mm in diameter onto wafers with fine-pitch accuracy and first-pass yields consistently better than 99%.
The integrated process begins with flux deposited at each interconnect site using DEK's sophisticated flux imaging technology.
The fully enclosed ProFlow ball transfer head, which can hold up to 50 million solder balls, guides each solder ball directly to the surface of the stencil with minimum friction.
A controlled placement force seats each ball gently but firmly in the flux, enhancing assembly integrity during downstream handling and reflow.
Cycle time is fast, consistent and independent of I/O count.
The excellent coplanarity that is achieved optimises electrical and mechanical performance.
PacTech USA is now offering the electroless Ni/Au UBM and mass solder bumping processes at its new facility in Santa Clara, California, where the company provides bumping and technology services in a 200m2 Class 10,000 clean room.
In addition, PacTech USA offers equipment sales, process technology transfer, training and support.
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