Product category:
PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Backside wafer coating process
Edited by the Electronicstalk Editorial
Team on 27 July 2004
Mass imaging platform runs backside
wafer coating
A new high throughput backside wafer coating process is capable of exceeding the +/-12.5mm total thickness variation stipulated by most wafer processing specialists.
DEK has successfully developed a high throughput backside wafer coating process, hosted on a cost-effective mass imaging platform and capable of exceeding the +/-12.5mm total thickness variation (TTV) stipulated by most wafer processing specialists The new process is compatible with underfill or adhesive-type coatings, normally applied at a nominal 50mm thickness to the backside of semiconductor wafers ahead of singulation
This article was originally published on Electronicstalk on 1 Aug 2005 at 8.00am (UK)
Related stories
Imaging platform turns to backside wafer coating
Long recognized as the world leader in high accuracy mass imaging technology, DEK has led the way with yet another cost-effective packaging solution.
Backside wafer coating process on show
DEK will show off its unique, cost saving and throughput enhancing packaging technologies at this year's Semicon West event in San Francisco, California.
"TTV is the critical success factor for any backside wafer coating process", said Clive Ashmore of DEK's Global Applied Process Engineering Group.
"By demonstrating our ability to meet the established criteria for backside wafer processing, we have opened new opportunities for semiconductor packaging specialists to increase throughput and reduce the cost per package by using high accuracy mass imaging".
"The equipment used is also inherently more flexible than dedicated backside coating machines, delivering an even higher return on investment for our customers".
The new process is compatible with DEK's metal stencil and emulsion screen technologies.
Metal stencils enable materials with larger filler particles, such as encapsulation materials to be applied with a totally smooth surface finish.
Mesh stencils allow other materials such as thermoplastic adhesives to be deposited accurately and at high speed.
In each case, the capabilities of both the machine and the stencil technology to achieving control over the print thickness and ensuring uniformity at high production volumes.
"To develop backside wafer coating as a turnkey process, ready for our customers to use immediately, our global applied process engineers are able to deliver a full implementation service at customer sites worldwide", added Ashmore.
"We are now intimately familiar with the impact of stencil technology, thread size, emulsion thickness, metal thickness, squeegee or ProFlow selection, and machine parameter settings, when implementing backside wafer processing using high accuracy mass imaging techniques".
• DEK: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
