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Product category: PCB Assembly Equipment and Tools
News Release from: DEK
Edited by the Electronicstalk Editorial Team on 25 February 2005

Stencil manufacturing begins in
Singapore

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DEK has opened a new advanced stencil manufacturing facility in Singapore to improve delivery and increase the level of experience and expertise available to its customers in Asia.

DEK has opened a new advanced stencil manufacturing facility in Singapore to improve delivery and increase the level of experience and expertise available to its customers in Asia The new state-of-the-art, 850m2 facility, is expected to produce between 600 and 800 E-Form stencils and 550 laser stencils per month for customers across the region

"As demand for high-quality stencils rockets, Asia's OEMs and ODMs are turning to DEK, not only as a source of high-quality, cost-effective stencils, but also more importantly as a partner in their production process", says Rich Heimsch, President of DEK International.

"Our 'Combined Strength' strategy is all about responding to our customers' needs, and in Asia our customers rely on our knowledge and expertise of printing and stencils to improve their time to market".

The new Singapore facility is DEK's largest and most advanced stencil manufacturing location.

With immediate effect, DEK is manufacturing a full range of stencils and screens, including laser-cut, additive, PumpPrint, electroformed and VectorGuard stencils for a variety of applications.

"With manufacturing sites throughout Europe, North America and Asia, DEK's stencil operations are some of the most advanced and far-reaching in the industry", Richard Tang, DEK's Singapore-based Global Eform Manager.

"This new facility is nearly four times the size of the old facility and employs just under 30 of Asia's top stencil experts".

"With this level of expertise and the capacity to increase production even further, we expect to increase in stencils sales in Asia by 100%".

"Our customers in the region include Japanese manufactures who have already made the switch to lead-free paste, to OEMs and ODMs manufacturing advanced communications and consumer products and semiconductor manufactures who use our expertise to simplify their solder ball placements, SIP, wafer bumping processes".

One of the key drivers for the new facility has been the increased popularity of DEK's electroformed (Eform) stencils as Asian manufacturers transition to lead-free manufacturing and finer-pitch assemblies.

DEK's Eform stencils incorporate the latest technologies and offer many benefits.

Eform stencils provide superior performance and ensure seal contact to the pad(s), pad paste deposit and a greater percentage volume of paste on pad.

The reactive force created by DEK Eform stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture.

This technology also delivers ultimate control over stencil thickness and uniformity, ensuring outstanding paste volume consistency for fine pitch applications.

And, as the electronics industry moves ever closer to the reality of lead-free manufacturing, DEK Eform stencils will become a necessity, as they improve solder paste release for some of the more challenging lead-free solder paste formulations.

The Singapore facility will also manufacture DEK's VectorGuard stencils, which are a safe, space-efficient and convenient choice for Asia's OEMs and ODMs.

Offering easier handling, management, storage and changeover, VectorGuard is a frame-mounted foil that is easier to store and manage than standard mesh-mounted stencils.

With VectorGuard, foils can be kept in a convenient and space-efficient hanging filing system, with no need to return each frame to the stencil supplier for credit and recycling.

The frameless VectorGuard system has been one of the most successful product introductions in the stencil marketplace, gaining quick acceptance and market penetration.

The easy handling, storage and the fact that it's kinder on the environment makes the VectorGuard system; which is now also available with interchangeable PumpPrint.

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