Product category:
PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Backside wafer coating process
Edited by the Electronicstalk Editorial
Team on 01 August 2005
Imaging platform turns to backside wafer
coating
Long recognized as the world leader in high accuracy mass imaging technology, DEK has led the way with yet another cost-effective packaging solution.
DEK has developed a high-throughput backside wafer coating process, hosted on a mass imaging platform and capable of exceeding the +/-12.5um total thickness variation (TTV) required by most wafer processing specialists The company's new process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50um thickness to the backside of semiconductor wafers prior to singulation
This article was originally published on Electronicstalk on 23 Jun 2005 at 8.00am (UK)
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Mass imaging platform runs backside wafer coating
A new high throughput backside wafer coating process is capable of exceeding the +/-12.5mm total thickness variation stipulated by most wafer processing specialists.
"For any backside wafer coating process, TTV is the critical success factor", says Clive Ashmore, DEK's Global Applied Process Engineering Group Manager.
"With this latest application advancement, we are helping semiconductor packaging manufacturers increase throughput and reduce the cost per package by using high accuracy mass imaging".
The equipment used in DEK's backside wafer coating process, which includes an optional wafer handler, DEK flexible printing platform and a reflow oven, is also inherently more flexible than dedicated backside coating machines.
The DEK system can be easily redeployed for other processing requirements and provides incredible flexibility while delivering an even higher return on investment.
DEK's backside wafer coating process is compatible with the company's metal stencil and emulsion screen technologies.
Metal stencils enable materials with larger filler particles, such as encapsulation materials, to be applied with a totally smooth surface finish.
Mesh stencils allow other materials such as thermoplastic adhesives to be deposited accurately and at high speed.
In each case, the capabilities of the machine and stencil technology are key to achieving control over the print thickness and ensuring uniformity at high volumes.
"As experts in materials deposition, we are now intimately familiar with the impact of stencil technology, thread size, emulsion thickness, metal thickness, squeegee or ProFlow selection and machine parameter settings when implementing backside wafer coating", says Ashmore.
"DEK has effectively taken our decades of applied materials expertise and created a cost-effective, fast and accurate solution for this critical packaging process".
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