Product category:
PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Ultrathin coating
Edited by the Electronicstalk Editorial
Team on 03 August 2006
Package permits ultrathin coatings
A next-generation equipment and tooling package enables the coating of wafers with ultrathin die attach materials down to 25 microns in thickness.
Fuelled by the need for faster processing times and smaller device footprints, DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25 microns in thickness Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging UPH (units per hour) requirements, limitations on chip footprint due to chip fillet formation and resin bleed and inherent quality and reliability issues that result from insufficient or uneven adhesive coverage
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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DEK's system effectively eliminates these issues, allowing the high-speed, high-accuracy uniform deposition of die attach materials as thin as 25 microns with tolerances of +/-7 microns using a printing process.
Utilising a Micron-class Galaxy mass imaging system, a DEK engineered ultraflat pallet, a die attach stencil or screen and a specially designed squeegee, DEK's backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with a highly accurate and flexible screen printing platform.
With this method, bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is exponentially higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required.
Further reading
Printers improve their image
DEK has upgraded its ProFlow DirEKt imaging system to enhance its effectiveness and applications.
Improved printing on show in Munich
The latest additions to DEK's ProFlow product family will break cover at Productronica this November.
The key enablers that allow the deposition of an ultrathin, 25 micron coating are the ultraflat pallet that provides the stability and uniformity required to process wafers as thin as 100 microns and up to 300mm in diameter, and the specially engineered squeegee that delicately applies the adhesive paste to the backside of the wafer.
Other significant advantages to DEK's process include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5mm), improved inventory control by concentrating the application of wet adhesive in the facility's dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films.
Not only is the DEK process delivering advances in die attach material applications, but can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
Because the process is run on a flexible mass imaging platform, the system can also be easily redeployed for other packaging applications such as wafer bumping, Direkt Ball Placement, thermal interface material (TIM) processing and encapsulation.
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