Product category:
PCB Assembly Equipment and Tools
News Release from: DEK | Subject: VPC
Edited by the Electronicstalk Editorial
Team on 10 July 2007
Carrier cuts down on alignment processes
Novel substrate centring and carrier technology enables multiple component support and alignment during screen printing and all subsequent assembly processes.
Building on the technology of its award-winning Virtual Panel Tooling (VPT) high throughput substrate imaging system, DEK has advanced this concept even further and developed Virtual Panel Carrier (VPC) A ground-breaking substrate centring and carrier technology, VPC enables multiple component support and alignment during screen printing and all subsequent assembly processes
This article was originally published on Electronicstalk on 28 May 2008 at 8.00am (UK)
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Traditional carrier technology used for processing small components generally requires individual component alignment and processing or the use of specialised and costly custom tooling to bring components into common alignment for printing.
With all of the current systems, separate alignment processes for each component must be carried out at every process stage, thus resulting in less than ideal throughput and expense.
DEK's new VPC technology alleviates these issues by enabling the components to be aligned once in the VPC for screen printing.
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Once this alignment occurs, no further adjustments are required for any of the subsequent assembly processes.
"The design of VPC is quite extraordinary", explains Neil MacRaild, DEK Americas General Manager.
"With equal force being applied to each side of the substrate or device, centring is consistent with no chance for even slight misregistration".
"Plus, the system utilises VPCs global fiducials instead of individual component fiducials, which simplifies all stages of assembly and dramatically improves UPH".
Through a unique design that consists of a base carrier with a low-maintenance consumable foil, DEK's VPC provides the stability, centring and alignment capabilities required to process multiple substrates or components in a single panel, dramatically improving throughput.
Parts are placed in the carrier either manually or loaded with a placement system.
Substrates are held in the carrier via a patented four-sided tensioning mechanism and then aligned within the carrier using an innovative centring system.
Parts are referenced using two global fiducials - as opposed to individual component fiducials - thus enabling the easy transfer of VPC throughout all assembly processes.
The system is also scalable, allowing manufacturers to adjust component quantity for individual processing requirements.
As electronics manufacturers continue to search for ways to reduce cost and enhance productivity, VPC is providing a simple alternative to current technology.
DEK's VPC enables an easy, one-time setup for the entire assembly process, exponentially improves UPH, provides for very fast changeover, allows for streamlined equipment set ups and may eliminate the need for expensive, high-maintenance tooling.
DEK will demonstrate VPC on Booth 8811 at Semicon West in San Francisco, California from 17th to 19th July 2007.
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