Product category:
Design and Development Software
News Release from: 3DLabs Semiconductor | Subject: DMS-02 Windows CE BSP
Edited by the Electronicstalk Editorial
Team on 22 February 2008
Media processor gains CE 5.0 support
BSP takes full advantage of the DMS-02's fully programmable media processing array and dual ARM architecture to deliver maximum application and media performance.
3DLabs Semiconductor will show off its new Windows CE board support package at Embedded World in Nuremberg The BSP takes full advantage of the company's DMS-02 fully programmable media processing array and dual ARM architecture to deliver unrivalled application and media performance for embedded and low-power consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices
This article was originally published on Electronicstalk on 29 Nov 2006 at 8.00am (UK)
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Manoj Rami, Senior Marketing Manager, Windows Embedded Business Group, Microsoft EMEA comments: "3DLabs' continued innovation on our platform shows how its market leading approach to providing better and faster processor solutions delivers unrivalled application and media performance in embedded and low-power consumer electronics devices".
The Windows CE 5.0 BSP is supported on the latest DMS-02 development system, a small footprint connected platform that includes: UI features (800 x 480 24bit LCD resistive touch screen, keyboard, mouse, buttons, microphone, headphone, line-in/out and speakers); connectivity (Wi-Fi, USB); storage (2Gbyte NAND, NOR Flash, SDCard, SDHC/MMC+ slot); and video I/O (HDMI TV encoder, analogue TV encoder, VGA camera).
"This Windows CE 5.0 BSP marks an important milestone in enabling our customers to take advantage of an industry-leading OS to bring feature rich devices to market quickly and efficiently", says Tim Lewis, Director Marketing, 3DLabs Semiconductor.
"By combining our intimate knowledge of our DMS-02 processor with a Windows CE BSP we can jump-start the product development of our customers and partners working in the Microsoft Windows CE ecosystem".
The DMS-02 media-rich applications processor is a multicore SoC that combines two ARM 926 cores with 3DLabs's proprietary SIMD array processor and an industry standard set of peripheral functions.
The fully programmable array performs all the media intensive tasks such as 2D/3D graphics, video encode/decode and image processing, offloading the ARMs and leaving them free to run CPU friendly tasks.
The Windows CE 5.0 BSP and supported DMS-02 development system are expected to ship to partners during Q1 2008.
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