http://www.electronicstalk.com/news/doo/doo000.html Dow Corning news releases on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Fri, 05 Sep 2008 08:00:00 UT Fri, 05 Sep 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Ultra-high-performance noncuring thermal grease is developed for use with Intel's newest mobile microprocessor, the Intel Core2 Extreme mobile processor QX9300. Thu, 21 Aug 2008 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo107.html TC-5121 gives customers robust thermal performance and high reliability at a better price than most other intermediate-performance compounds. Wed, 12 Mar 2008 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo106.html Compound claims a new industry standard for thermal grease performance, with extremely low thermal resistance, high reliability and stability under adverse conditions. Wed, 26 Sep 2007 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo105.html Materials remain flexible and stable over wide temperature variations and offer easy reparability and global availability. Fri, 07 Sep 2007 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo104.html High-performance thermal adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity. Wed, 09 May 2007 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo103.html First controlled-volatility thermally conductive adhesive designed and developed specifically for customers in China and Taiwan. Wed, 21 Mar 2007 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo102.html Dow Corning Corporation has launched an expanded family of silicone materials for the fast-growing light emitting diode (LED) market. Thu, 25 May 2006 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo101.html Cambridge University Electrical Engineering Division has completed and equipped a new research facility for the development of emerging technologies across a variety of markets. Tue, 25 Apr 2006 08:00:00 UT Dow Corning http://www.electronicstalk.com/news/doo/doo100.html