Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Dow Corning | Subject: Dow Corning DA-6534
Edited by the Electronicstalk Editorial
Team on 09 May 2007
Adhesive helps keep flip-chip BGAs cool
High-performance thermal adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity.
To address the issue of overheating in advanced flip-chip ball grid array (FC-BGA) devices, Dow Corning Electronics has unveiled its Dow Corning DA-6534 high-performance thermal adhesive This unique, one-part adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures, providing long-term reliability for today's leading-edge semiconductor devices
This article was originally published on Electronicstalk on 25 May 2006 at 8.00am (UK)
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Achieving thermal resistance of 0.09cm2C/W at 24um the new adhesive has already been qualified for manufacturing by two major device makers.
Silicone-based adhesives act as bonding agents for numerous components throughout the microelectronics industry.
As semiconductor devices become more complex and circuitry shrinks, the heat generated from these devices increases significantly.
To effectively remove this heat, a high thermally conductive and adaptable thermal interface material (TIM) is needed to perform the dual role of bonding the chip into its package and transferring heat away from the chip toward an integrated heatsink.
TIM adhesives must strike a precise balance of physical properties to protect packaged chips from stresses caused by differences in the coefficients of thermal expansion (CTE) among the chip, package and heatsink.
With its novel silicone and silver-based formulation, Dow Corning's new adhesive surpasses the performance of traditional TIMs on the market today.
Other TIMs may require high thermal loading of more than 70% filler or use ceramic fillers, both of which can compromise adhesion and thermal reliability.
Alternatives such as epoxy-based adhesives offer substandard adhesion and a high modulus, which can lead to cracking or voids that degrade the performance of the packaged chip.
As a thixotropic material, DA-6534 offers good dispensability, and its bondline thickness (BLT) can be controlled through pressure and time.
In addition, DA-6534 has been designed to be completely inert and not produce any byproducts, which it achieves through the hydrosilylation reaction of vinyl polymers and a hydrogen cross-linker.
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