Thermal analysis takes in IC packaging
A
Daat Research Corp product story
Edited by the Electronicstalk editorial team
Jul 31, 2008
Powerful tools for modelling IC packages are among the latest additions to Coolit CFD thermal analysis software.
Daat Research Corp has added powerful tools for modelling IC packages into its Coolit CFD thermal analysis software.
The tools introduced to Coolit v.8 build detailed parametric chip models that can be converted to compact models, and the user can switch between detailed and compact models as desired.
Included is a library of hundreds of popular BGA, DIL and QFP packages.
The user can copy and modify the models, or add new models to the library.
Coolit v.8 also delivers many improvements in algorithms for computation and presentation of results.
These and many other enhancements make Coolit even more user-friendly and powerful to use.
Coolit v.8 is now shipping.
Not what you're looking for? Search the site.
Contact Daat Research Corp
Related Stories
- Imagination adds to VXE video encoder range
- Zuken enhances PCB design software
- NIAP certifies Integrity-178B operating system
- Integrity Global Security to market secure systems
- Green Hills linked with 3S-Smart Software
Categories
- Active Components (11,917)
- Passive Components (2,949)
- Design and Development (9,394)
- Enclosures and Panel Products (3,246)
- Interconnection (2,841)
- Electronics Manufacturing, Production, Packaging (3,055)
- Industry News (1,898)
- Optoelectronics (1,616)
- Power Supplies (2,297)
- Subassemblies (4,551)
- Test and Measurement (4,956)
