Thermal analysis takes in IC packaging
A
Daat Research product story
Edited by the Electronicstalk editorial team
Jul 31, 2008
Powerful tools for modelling IC packages are among the latest additions to Coolit CFD thermal analysis software.
Daat Research Corp has added powerful tools for modelling IC packages into its Coolit CFD thermal analysis software.
The tools introduced to Coolit v.8 build detailed parametric chip models that can be converted to compact models, and the user can switch between detailed and compact models as desired.
Included is a library of hundreds of popular BGA, DIL and QFP packages.
The user can copy and modify the models, or add new models to the library.
Coolit v.8 also delivers many improvements in algorithms for computation and presentation of results.
These and many other enhancements make Coolit even more user-friendly and powerful to use.
Coolit v.8 is now shipping.
