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News Release from: Dynamix Technology
Edited by the Electronicstalk Editorial
Team on 30 January 2002
Document addresses SM solder reliability
issues
Dynamix Technology has introduced IPC-9701.
Dynamix Technology has introduced IPC-9701 As the pressure on the industry increases many companies are looking to become more efficient
It is important that reliability isn't sacrificed to cut costs.
IPC-9701 establishes the levels of performance and reliability for surface mount attachments of electronic assemblies allowing manufacturers to approach any problems before production.
In addition to an understanding of the physics of surface mount solder joint failure, this document also provides an approximate means of relating the results from the performance test methods included to the reliability of solder attachments for the use environments and conditions due to electronic assemblies.
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