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News Release from: Dynamix Technology
Edited by the Electronicstalk Editorial
Team on 03 June 2003
Standard guides on high-density
interconnects
Designers and manufacturers looking for the next level of guidance on building high-density interconnect (HDI) boards will welcome IPC-2226.
Designers and manufacturers looking for the next level of guidance on building high-density interconnect (HDI) boards will welcome IPC-2226 Used in conjunction with IPC-2221, this standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and its forms of component mounting and interconnecting structures
Based on years of industry manufacturing and design experience, the standard provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via formation and metallisation requirements and other design features that are necessary for HDI-advanced IC interconnection substrates.
Tradeoff analyses required to match the mounting structure to the selected chipset are included.
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