Guide to optical and optoelectronic packaging

Edited by the Electronicstalk editorial team Aug 12, 2003

A new guide addresses the implementation of optical and optoelectronic packaging technologies.

A new guide addresses the implementation of optical and optoelectronic packaging technologies.

The areas discussed in IPC-0040 include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products.

Optoelectronic packaging technologies covered include active and passive components and discrete fibre cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.