DVDs provide in-depth soldering training

Two new training DVDs from Dynamix Technology will help manufacturers train and test operators in critical solder joint requirements.

Two new training DVDs from Dynamix Technology will help manufacturers train and test operators in the critical solder joint requirements from IPC-A-610C (Acceptability of electronics assemblies) and J-STD-001C (Requirements for soldered electrical and electronic assemblies).

IPC-DVD-SMT-C-K "Surface mount solder joint workmanship standards" and IPC-DVD-PTH-CK "Through-hole solder joint workmanship standards" are clear and easy to follow and provide an excellent an opportunity for new operators to digest and retain vital criteria for soldering PCB assemblies.

Certification ensures that operators have fully understood and retained the information leading to fewer defects and improved reliability.

These versatile courses mean manufacturers can take advantage of group training and can also be used as part of a stand-alone training programme where students can select either Class 2 or 3 from the main menu, and study each requirement at their own pace.

The DVDs provide fast, effective and documented training/verification for ISO9000 requirements.

IPC-DVD-SMT-C-K "Surface mount solder joint workmanship standards with training certification" includes workmanship standards for chip components, J-lead and gullwing solder joints as illustrated in the IPC-DRM-SMT-C "Surface mount solder joint evaluation desk reference manual" (copy included free with purchase).

The DVD-SMT-C disk also includes a written test, along with printable certificates for students with passing grades.

Although this disk does not certify a company to the entire IPC-A-610C specification, it does provide IPC Training Certification to the specific A-610 criteria contained in this media-based training programme.

IPC-DVD-PTH-CK "Through-hole solder joint workmanship standards with training certification" covers three sections.

Section one covers PTH solder joint terminology, industry specifications for solder joint acceptance standards, product classes and process indicators.

Section two details the min/max acceptable dimensional and visual requirements for component side; barrel; and solder side.

Section three explains visual defect criteria for solder balls, projections, bridging, webbing, voids, cold/disturbed joints, exposed basis metal, fractures, lead protrusion and flux residues.

Course contents are derived from the IPC-DRM-40E "Through-hole solder joint evaluation desk reference manual" (copy included free with purchase).

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