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Product category: VMEbus Boards and Assemblies
News Release from: Dy 4 Systems | Subject: Champ-AV II
Edited by the Electronicstalk Editorial Team on 18 March 2003

DSP boards break 1Gbyte/s data transfer
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Dy 4 Systems is claiming a new milestone of board-to-board data movement performance for its latest Champ-AV II digital signal processing product has reached.

Dy 4 Systems is claiming a new milestone of board-to-board data movement performance for its latest Champ-AV II digital signal processing product has reached Under a demanding and realistic scenario, data were transferred across the fabric in both directions simultaneously at an aggregate sustained throughput of 1.01Gbyte/s

This new level of performance was demonstrated using two Champ-AV II quad PowerPC cards interconnected with StarLink PMC modules.

It extends the number and type of complex signal processing algorithms that are now within the reach of price-competitive COTS DSP products.

Applications such as synthetic aperture radars (SARs) require many processors to attain true real-time performance.

Such applications require a "corner turn" of the data set, involving the redistribution of all the data between the range and azimuth processing stages.

The performance of the interconnection fabric between the processing stages is a key factor in the performance and cost of the radar.

Sonar and digital-radio beam-formers have nearly identical computational requirements to process data from multiple sensors.

The Champ-AV II features QuadFlow architecture, with four complete 500MHz MPC7410 PowerPC processor nodes, interconnected with high-speed 64bit, 66MHz PCI buses.

Even while transferring 1Gbyte/s during the demonstration, two of four PCI buses remained fully available for further node to node transfers, highlighting the capability of the architecture.

In addition, approximately two-thirds of the main memory bandwidth and all of the L2 cache bandwidth remained available to the processors.

StarFabric is compatible with standard VME backplane technology, without the use of special active backplanes, optical cabling or alternative connectors.

Dy 4's Champ-AV II and the StarLink PMC module are available now, in both air-cooled and extended temperature, conduction cooled form factors, suitable for application in many demanding environmental conditions.

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