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Product category: VMEbus Boards and Assemblies
News Release from: Dy 4 Systems | Subject: Champ-FX
Edited by the Electronicstalk Editorial Team on 03 March 2004

FPGA platform tackles harsh applications

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The Champ-FX brings the power of FPGA-based processing to the Champ line of high-density processing solutions.

The Champ-FX brings the power of FPGA-based processing to the Champ line of high-density processing solutions The Champ-FX is a 6U VME form-factor board designed around a pair of Xilinx Virtex-II Pro FPGAs as the core engines

It provides a balanced architecture with high-bandwidth memory and I/O subsystems to effectively harness the computational power of the Virtex-II Pro.

Each FPGA is fitted with 256Mbyte of DDR SDRAM and 8Mbyte of DDRII SRAM that together provide more than 8Gbyte/s of memory bandwidth.

Algorithms needing intermediate storage benefit from the fast SRAM, while the large SDRAM is often needed for input and output data buffers.

Both memories can serve application code running on the hardwired PowerPC of the Virtex II Pro.

To keep the processing engines fed with data, the Champ-FX has numerous high-speed I/O capabilities including 3Gbyte/s of RocketIO, two PMC/XMC sites that feature 64bit, 66MHz PCI interfaces (528Mbyte/s peak) and also parallel LVDS interfaces (1Gbyte/s bidirectional) compliant with the VITA 42 XMC switched mezzanine specification.

The VITA 42 capability will support next-generation PMC modules such as digital radio receivers that can use the high-bandwidth connection between PMC and FPGA.

Systems comprising multiple Champ-FXs can be interconnected via the onboard RocketIO high-speed serial interfaces.

The Champ-FX also integrates with Dy 4's PowerPC products via two StarFabric bridges that provide approximately 880Mbyte/s of bandwidth into a StarFabric network.

The Champ-FX is suited to the front-end processing of radar, sonar and signal-intelligence applications that typically have very high data rates and algorithmic requirements that can be implemented effectively with FPGAs.

For these types of applications, the Champ-FX can replace tens to hundreds of PowerPC processors, resulting in lower system power, weight and cost.

The power of FPGA processing also allows developers to offer upgrades to existing systems with significant additional capability.

The Champ-FX is a critical component of Dy 4's total DSP solution.

The company offers customers complete switch fabric connected systems that comprise PowerPC and FPGA processing, distributed I/O and a high performance inter-processor communication software layer that abstracts the hardware to simplify the task of building multi-processor application software.

To reduce customer's time to market, the Champ-FX will be supported with a library of reference designs and ready-to-use VHDL modules to implement memory interfaces, DMA, PCI, RocketIO and support for the Xilinx II Pro internal PowerPC processor.

Currently, the Champ-FX is the only product of its kind that is suitable for deployment in harsh-environment systems.

The board will be offered in commercial air-cooled, rugged air-cooled and conduction-cooled configurations.

The Champ-FX has numerous features targeted at the needs of designers of rugged embedded systems including power and thermal monitoring functions.

It will be available in the second quarter of 2004.

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