Custom enclosures enhance performance
Cost-effective custom enclosures, tailored to meet the most diverse and demanding individual applications, can now be supplied by EC Electronics using its K-Box system.
Cost-effective custom enclosures, tailored to meet the most diverse and demanding individual applications, can now be supplied by EC Electronics using its K-Box system.
Competing successfully with established systems at lower cost, the K-Box portfolio offers OEMs and system builders high-specification solutions with no compromise on quality or specification level.
To meet specific performance requirements, in liaison with customers, a powerful CAD/CAM design suite is used to optimise price-to-performance ratios, delivering fully fit-for-purpose results quickly and efficiently.
Manufactured in high-impact polystyrene, K-Box enclosures can be produced in a wide range of shapes and sizes.
In addition to the provision of unpopulated enclosures for third-party assembly, the company produces part-built bespoke enclosure systems at all levels of completion.
For example, I/O connections, cable harnesses, power supply modules, keyboards and displays can be incorporated - speeding and simplifying final assembly by the customer.
Tailored turnkey systems are also available, from prototypes to volume production.
Cost-effective flexibility lies at the heart of the K-Box custom CAD/CAM system, which negates the need for investment in tooling, forming equipment or moulds.
Quality is assured at all levels, under the company?ccredited ISO 9002 production, control and protection umbrella.
Established application areas include industrial electronics, automotive, medical, defence and professional leisure industries.
Available in a wide range of colours, the high-impact polystyrene enclosures can be provided in thicknesses from 3 to 10mm.
A variety of finishes, colours and textures can be readily incorporated, along with structural considerations such as apertures, partitions, PCB supports and handles.
Optional UL94V0 ratings and EMI/RFI shielding, further expand application potential.
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