Benchtop system automates solder application

Edited by the Electronicstalk editorial team Dec 6, 2004

EFD's new SolderPlus dispensing system provides a cost-effective way to automate the application of solder in benchtop assembly processes.

EFD's new SolderPlus dispensing system provides a cost-effective way to automate the application of solder in bench top assembly processes.

This compact package integrates three EFD products - high-performance EFD SolderPlus solder paste, a precision dispense valve, and a new x-y-z positioning platform.

SolderPlus solder paste is specially formulated for precise, trouble-free dispensing without clogging or separating.

It is conveniently prepackaged in disposable syringes, and available in a range of alloys, including lead-free, with no-clean, water-soluble, RMA and RA flux systems for soldering a broad range of metals, including stainless steel.

SolderPlus is applied with an EFD auger or piston valve mounted on the new EFD Ultra TT tabletop automation system, which incorporates precise dispensing control and accurate positioning functions into one compact unit.

Every "All EFD" system is configured by EFD's own application specialists to deliver a low-cost, automated solution tailored for each customer's specific application requirements, without the risks and unknowns often associated with process integration.