New dimension to solder print analysis

Ekra has developed a novel 3D post-print inspection (PPI) system for the complete analysis and assessment of solder printing during the printing process.

Ekra has developed a novel 3D post-print inspection (PPI) system for the complete analysis and assessment of solder printing during the printing process.

An advance on existing technology, Oppus I is able to minimise or even avoid costly faults in stencil printing of SMT, hybrid and advanced packaging applications.

According to Ekra, in today's complex processes, a two-dimensional inspection system is no longer sufficient to detect defects in solder printing.

Ekra has therefore developed an efficient 3D solder paste inspection system for advanced print processes that excels through short inspection times, high measuring precision and easy handling at a favourable price/performance- ratio.

Ekra's new 3D PPI system Oppus I is based on a novel modular inline machine concept deploying highly precise and extremely fast sensor technology.

The system uses the Fast Moire Interferometry methodology developed and patented in 1999 by Canadian company SolVision.

The development of Oppus I follows a co-operation agreement between Ekra and SolVision.

Essential features of Oppus I include a patented "teach" process and quick and easy program setup, offering the user high process security with optimised handling comfort.

Generating a new program for a complete board, including setting all parameters, takes about 5min.

The central component of the measuring system is a digital camera with a projector unit that projects white light structures onto any surface.

The 2D and 3D information from the measured object are extracted simultaneously from the system.

By using just one camera, calibration, mounting, alignment and any maintenance work become much easier compared with technologies that use several cameras or scanner units.

The next step is using AAC (adaptive artificial control).

The PPI system and a very precise printer communicate online to exchange the latest data.

This intelligent data exchange makes it possible to run a trend and parameter analysis after every printing cycle.

By sending back the inspection results to the respective interfaces of the print system, the complete printing process is surveyed by a true adaptive artificial control.

The closed loop includes the newly developed Vario print head.

With this new technology potential faults can be recognised early, avoiding expensive print errors.

In addition, Oppus I offers features like stencil measurement and a very user-friendly interface.

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